Parquet and adhesion technology
SPECIAL ADHESIVE INJECT MS-K 55
- cavity filling under parquet
- no hazardous substances, exempt from labelling
- no post-swelling
- ready for processing
- very low emission, EC1
High-quality, solvent and water-free, low viscosity, permanently elastic, cavity-filling MSP adhesive for fixing hollow parquet elements. Label-free and, therefore, ecologically and physiologically harmless. No post-swelling or foaming. Very low emissions and odourless. For underspraying of cavities or post-adhesion of loose elements.