Parquet and adhesion technology

SPECIAL ADHESIVE INJECT MS-K 55

  • cavity filling under parquet
  • no hazardous substances, exempt from labelling
  • no post-swelling
  • ready for processing
  • very low emission, EC1

High-quality, solvent and water-free, low viscosity, permanently elastic, cavity-filling MSP adhesive for fixing hollow parquet elements. Label-free and, therefore, ecologically and physiologically harmless. No post-swelling or foaming. Very low emissions and odourless. For underspraying of cavities or post-adhesion of loose elements.

Colour
white/beige

Service

Tools for your daily work

For all those who want to know more, you will find here further product information at a glance and as a download.

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