Our website uses cookies, to enable certain functions.
By using our website, you consent to the use of cookies. As described in our Data protection.

Parquet and adhesion technology


  • cavity filling under parquet
  • no hazardous substances, exempt from labelling
  • no post-swelling
  • ready for processing
  • very low emission, EC1

High-quality, solvent and water-free, low viscosity, permanently elastic, cavity-filling MS adhesive for fixing hollow parquet elements. Inject MS-K55 is non-labelled and therefore an ecologically and physiologically harmless alternative to PUR resins. No post-swelling or foaming, permanently elastic. Very low emission according to EC1 and odourless. For underspraying of cavities or post-adhesion of loose elements.



Tools for your daily work

For all those who want to know more, you will find here further product information at a glance and as a download.


Always up
to date