Tile laying technology
THERMO-TOP WÄRMEVERTEILUNGS- UND ENTKOPPELUNGSPLATTE
- rapid, even heat distribution
- stress-reducing underlay
- safer on problematic substrates
- very low emission - EC1-PLUS
Stress-relieving heat distributing and decoupling board for ceramic tiles and natural stone, as well as for parquet, multi-layer parquet and laminate especially for rapid and even heat distribution over underfloor heating system and also for problematic substrates. The thermo-top heat distributing and decoupling board is a very low emission laying material (acc. to GEV), breakproof and rot-resistant. Can be used as heat distribution and decoupling board on wall and floor areas indoors under many covering materials (ceramic tiles and natural stone, parquet, multi-layer parquet and laminate) for traffic loads of up to 5 kN/m². For ceramic tiles and natural stone with a material thickness of less than 10 mm as well as for any covering formats less than 30 x 30 cm, filling is required with a fibre-reinforced filler (min. 3 mm layer thickness).